Emerson will present integrated motion, pneumatic, and electric automation systems supporting advanced machine design and high-performance OEM applications.
With its excellent resistance to welding, the DS2000 Series suppresses the formation of built-up edges, while its high coating adhesion significantly reduces coating delamination.
ANCA introduces a performance engineering program focused on reducing grinding cycle times through process optimization, software tuning, and machine-level productivity improvements.
With its optimised lift-dip module, EUTECT enhances process stability and precision in selective dip soldering, delivering reproducible results while reducing thermal stress on demanding assemblies.