With its excellent resistance to welding, the DS2000 Series suppresses the formation of built-up edges, while its high coating adhesion significantly reduces coating delamination.
ANCA introduces a performance engineering program focused on reducing grinding cycle times through process optimization, software tuning, and machine-level productivity improvements.
With its optimised lift-dip module, EUTECT enhances process stability and precision in selective dip soldering, delivering reproducible results while reducing thermal stress on demanding assemblies.
Tungaloy's SpinJet is a speed-increasing spindle that enables high-speed rotation of small-diameter tools and high-efficiency machining when mounted on existing machine tools.
Live demonstrations featuring NVIDIA-based edge AI systems, robotic automation, lightweight VLM deployment and agentic AI workflows will showcase real-time AI processing at the edge.