TRUMPF presents laser etching and plasma power technologies designed to improve efficiency, process stability, and cost control in semiconductor manufacturing.

At Blechexpo 2025, TRUMPF will present a connected laser cutting, punching, and bending system with a STOPA material buffer, combining productivity, flexibility, and line production efficiency.

At Blechexpo, TRUMPF showcases the mobile bending cell Flex Cell with TecZone Bend, reducing programming effort to seconds and enabling effortless bending of even complex parts.

TRUMPF presents new solutions at Blechexpo in Stuttgart (October 21–24) that enable sheet metal manufacturers to make bending processes more efficient and economical. CEO Stephan Mayer showcases the highlights in a video.

From 21 to 24 October, at Blechexpo 2025 in Stuttgart, TRUMPF will be showcasing a new and completely redesigned version of its TruBend 3000 series of bending machines.

EKPO equips a production line with fiber lasers to meet global fuel cell demand, welding ultrathin 75–100 μm plates for efficient coolant flow.

Laser, optics, and sensor technology for complex component manufacturing with integrated quality control to boost efficiency from the first part, suitable for all industries.

UKP lasers are designed for processing large surfaces and enable multiple processing steps at once, resulting in higher productivity.

The company increased UKP laser power to 300 watts and added real-time control, enabling precise, industrial-scale production of films, displays, and membranes.

New beam source for welding applications: powerful from 500 W to 50 kW, user-friendly control, robust for industrial use, flexible in connected manufacturing environments.